Photovoltaic diamond wire cutting resin board

Can diamond wire sawing be used for photovoltaic silicon wafers?

This paper reviews recent research on diamond wire sawing of photovoltaic silicon wafers and compares it with the loose abrasive wire sawing process from a standpoint of sustainable manufacturing.

Is fixed abrasive diamond wire sawing a sustainable manufacturing alternative?

Concluding remarks In this paper, we reviewed fixed abrasive diamond wire sawing as a sustainable manufacturing alternative to loose abrasive slurry sawing of silicon wafers.

Can diamond wire sawing improve wafer production?

The results suggest that the diamond wire sawing process, with its potential for higher material removal rates and ductile mode cutting, could prove useful in producing stronger and higher quality wafers without sacrificing productivity.

What is fixed abrasive diamond wire sawing (DWS)?

Recent industry trends indicate a shift from the loose abrasive slurry (LAS) sawing to fixed abrasive diamond wire sawing (DWS) process for slicing silicon wafers [2, 3]. DWS offers several advantages including smaller kerf loss, reduced wafer cost, and greater environmental friendliness when compared to the LAS process.

Which cutting fluid is used in diamond wire sawing?

Generally, mono-crystalline diamonds are used in the production of the diamond wire. Water based cutting fluid is generally used for cooling and lubrication in the diamond wire sawing. A recent study found the chemo-mechanical effects of the cutting fluid to lower the hardness of silicon, and thereby enhance ductile mode material removal .

How abrasive properties affect diamond wire sawing?

Effect of abrasive properties Abrasive parameters affect both loose abrasive slurry and fixed abrasive diamond wire sawing because they impact the micro-mechanical interaction between the abrasives and silicon during cutting.